In modern electronics manufacturing, with the continuous improvement of chip integration and increasingly sophisticated packaging structures, traditional pin connection methods are no longer sufficient to meet the demands of high performance, miniaturizat
Behind smartphones, high-performance computing chips, automotive electronics, and advanced packaging technologies lies a crucial micro-component—the solder ball—almost invisible to the naked eye.
In the wave of miniaturization and high performance in modern electronic devices, the connection between chips and circuit boards has long surpassed the visible pin soldering, entering a precise world constructed of tiny metal spheres.
As semiconductor packaging technology advances towards higher density, miniaturization, and higher reliability, the electrical connection between chips and substrates increasingly relies on tiny yet critical interconnect media.
Solder balls, as a high-purity, high-consistency pre-formed solder, exhibit unique advantages in the precision soldering of complex circuit boards, one of their core strengths being excellent wetting properties.
Unlike traditional lead soldering, solder balls form tiny but structurally complete solder joints after reflow soldering. These solder joints not only perform signal transmission functions but also need to maintain long-term reliability under complex cond