In the precision world of modern electronics manufacturing, BGA (Ball Grid Array) packaging technology, with its high-density interconnect capabilities, has become an indispensable carrier for high-performance chips. At the core of this technology are tin
In today's wave of electronic devices evolving towards thinner, lighter, higher-performance, and more multifunctional devices, the connection between chip packages and circuit boards is becoming more precise than ever before.
With the dual goals of green and high-reliability electronic manufacturing, lead-free solder balls have gradually replaced traditional tin-lead alloys, becoming the mainstream choice for advanced packaging interconnect technologies such as BGA and CSP.
With the continuous development of modern electronic products towards high performance, miniaturization, and high integration, packaging technology has become a key factor determining the overall system performance.
In the global wave of transformation towards green and sustainable development in the electronics manufacturing industry, lead-free solder balls have become an indispensable core interconnect material in surface mount technology (SMT) and advanced packagi
In today's rapidly evolving landscape of high-density, high-performance electronic devices, chip packaging technology continues to evolve. Among these advancements, Ball Grid Array (BGA) packaging, with its superior electrical performance, heat dissipatio