The flux's solvent and resin system must also be compatible with the lead-free solder ball soldering process to ensure compatibility and soldering quality.
In modern electronic packaging, BGA solder balls serve as a critical interface between chips and printed circuit boards. Their surface condition directly impacts the reliability of the soldering process and the quality of the resulting solder joints.
In electronics manufacturing, solder is a key material for connecting components to printed circuit boards, and its performance directly impacts the product's electrical reliability and long-term stability.
These solder balls not only provide the mechanical connection between the chip and the printed circuit board, but also serve as crucial carriers for electrical signals, power, and ground paths.
Though small, solder balls are indispensable "microbridges" in chip packaging. They silently stand between the chip and the outside world, enabling the flow of information, the transfer of energy, and system stability.
In the precision world of modern electronics manufacturing, soldering is no longer simply about connecting metals; it's a systematic process crucial to product reliability