During the preheating phase, the heating rate must be controlled at 1.5-2.0°C/second to prevent the solder ball from cracking due to thermal stress or the solder paste solvent from boiling.
Wettability is a fundamental indicator of soldering quality, and the oxide layer on the surface of lead-free solder balls can significantly hinder the direct contact between molten solder and the substrate metal.
As a key connection component in electronic packaging, the fatigue resistance of the solder ball directly affects the reliability of the device in a vibration environment.
During the laser welding process, the lead-free solder ball needs to undergo a precise melting and solidification process.
In the manufacture of high-density electronic packages, especially ball grid arrays, chip-scale packages, and flip-chips, solder balls not only serve as carriers for electrical interconnects but also exhibit a nearly "intelligent" behavior during the refl
In this context, the solder ball, a critical interconnect between the chip and the substrate, is no longer simply a "conductive bridge" but a core component that directly impacts signal integrity, thermal management, and system reliability.