As an important material in electronic packaging, lead-free solder balls are gradually replacing traditional lead-containing solders and becoming a safer and more environmentally friendly soldering solution.
Lead-free solder ball plays a vital role in modern electronic packaging process, especially in improving the precision of soldering process.
The reason why solder balls can become the core material of advanced display packaging is mainly due to its advantages in micron-level precision, excellent conductivity
The reason why solder balls have become the preferred interconnection method for flip chip packaging is mainly due to their advantages in high-density interconnection
In this context, high-performance solder balls have gradually become the secret weapon in ultra-fine pitch packaging due to their excellent connection performance and reliability.
In this process, solder balls play a vital role. Solder balls, as key components connecting chips and substrates, not only directly affect the performance and reliability of electronic products