The core components and microstructure of the solder ball are the key factors that determine its welding performance. The two interact with each other and affect the quality and reliability of welding in many ways.
In the modern electronic manufacturing industry, as electronic products develop towards miniaturization, high density and high performance, the requirements for welding materials are getting higher and higher.
. Solder ball, as a key component in advanced packaging technologies such as BGA (Ball Grid Array) and CSP (Chip Scale Package), greatly improves the reliability of electronic component connections through its unique structure and material properties.
Shenzhen Putai New Materials Co., Ltd. is located in Nanshan District, Shenzhen City, Guangdong Province, China. Since its establishment in 2014, it has been committed..