The key process parameters for controlling volatiles include nitrogen purity, oxygen concentration in the furnace, temperature profile and conveying speed.
Low solids content, halogen-free flux can significantly reduce post-soldering residue and harmful gas generation.
Although small, solder balls are essential "precision components" in the SMT process. Their dimensional accuracy, coplanarity, surface quality.
Innovations in solder ball technology, particularly the use of low-temperature solder balls, are becoming a key breakthrough in achieving the safe assembly of these devices.
Strong antioxidant properties can also reduce the harshness of storage conditions and reduce the company's warehousing costs, which is also an important manifestation of its benefits.
The flux's solvent and resin system must also be compatible with the lead-free solder ball soldering process to ensure compatibility and soldering quality.