The diverse substrate materials of flexible electronic devices pose a challenge to the compatibility of lead-free solder balls.
The slow cooling process experienced by the droplets in the droplet method is of great significance in terms of internal density.
Lead-free solder balls play a vital role in electronic packaging processes, especially in BGA (ball grid array) packaging technology.
As an indispensable connection material in the field of electronic packaging, the surface treatment process of solder balls plays a vital role in improving their antioxidant properties.
In actual electronic manufacturing production lines, the compatibility advantages of solder balls have been fully verified.
When the lead-free solder ball enters the soldering process, the dry solder ball can quickly achieve good fusion with the soldering surface.