In the field of multi-chip integrated packaging, solder balls play a vital role. Their connection flexibility brings many significant advantages to the entire packaging process and the performance of the final product.
During long-term use, electronic equipment will inevitably be subjected to mechanical forces such as vibration and impact.
After soldering is completed, you can use special tools to slightly trim the solder joints before the solder completely cools and solidifies.
With the help of microscopes and other precision testing instruments, technicians can zoom in and observe the details on the surface of the solder ball to check whether there are any impurities remaining.
Electrical performance is one of the important indicators of solder balls. After long-term use, its electrical performance will also be affected.
Under high temperature conditions during soldering, active substances such as hydrogen ions in the water may chemically react with the lead-free solder ball and pad materials.