In the context of modern electronic devices constantly pursuing thinner, lighter, higher-performance, and more multifunctional designs, integrated circuit packaging technology faces the challenge of connecting an increasing number of signal, power, and gr
In advanced electronic packaging, especially in high-density interconnect structures such as BGA (Ball Grid Array) and CSP (Chip Scale Package), solder balls, though tiny, bear multiple responsibilities: electrical connection, mechanical support, and heat
Hidden within the core of smartphones, laptops, servers, and even high-end graphics cards lies a crucial micro-component—BGA (Ball Grid Array) packaged chip—almost invisible to the naked eye.
In today's highly integrated electronic world, from smartphones to AI servers, from wearable devices to aerospace control systems, the way chips connect to circuit boards is undergoing a silent but profound transformation.
In modern electronics manufacturing, with the continuous improvement of chip integration and increasingly sophisticated packaging structures, traditional pin connection methods are no longer sufficient to meet the demands of high performance, miniaturizat
Behind smartphones, high-performance computing chips, automotive electronics, and advanced packaging technologies lies a crucial micro-component—the solder ball—almost invisible to the naked eye.