The reason why solder balls have become the preferred interconnection method for flip chip packaging is mainly due to their advantages in high-density interconnection
In this context, high-performance solder balls have gradually become the secret weapon in ultra-fine pitch packaging due to their excellent connection performance and reliability.
In this process, solder balls play a vital role. Solder balls, as key components connecting chips and substrates, not only directly affect the performance and reliability of electronic products
The core components and microstructure of the solder ball are the key factors that determine its welding performance. The two interact with each other and affect the quality and reliability of welding in many ways.
In the modern electronic manufacturing industry, as electronic products develop towards miniaturization, high density and high performance, the requirements for welding materials are getting higher and higher.
. Solder ball, as a key component in advanced packaging technologies such as BGA (Ball Grid Array) and CSP (Chip Scale Package), greatly improves the reliability of electronic component connections through its unique structure and material properties.