Solder balls—miniature metal spheres typically only 0.1 to 0.8 millimeters in diameter—are key interconnect components in advanced packaging technologies.
Though tiny, the solder ball carries immense weight. In the field of industrial control, where reliability requirements are almost demanding, it silently and steadfastly builds a bridge of trust between chips and systems.
During the preheating phase, the heating rate must be controlled at 1.5-2.0°C/second to prevent the solder ball from cracking due to thermal stress or the solder paste solvent from boiling.
Wettability is a fundamental indicator of soldering quality, and the oxide layer on the surface of lead-free solder balls can significantly hinder the direct contact between molten solder and the substrate metal.
As a key connection component in electronic packaging, the fatigue resistance of the solder ball directly affects the reliability of the device in a vibration environment.
During the laser welding process, the lead-free solder ball needs to undergo a precise melting and solidification process.