In today's rapidly evolving landscape of high-density, high-performance electronic devices, chip packaging technology continues to evolve. Among these advancements, Ball Grid Array (BGA) packaging, with its superior electrical performance, heat dissipatio
In the field of advanced electronic packaging, lead-free solder balls serve as tiny yet crucial electrical and mechanical connection points between chips and substrates, and their performance directly determines the reliability of the entire electronic sy
With the increasing trend towards thinner and more portable modern electronic devices, circuit boards not only need to withstand vibrations and thermal cycling during daily use, but also must endure accidental drops, bending, or mechanical impacts.
In the context of modern electronic devices constantly pursuing thinner, lighter, higher-performance, and more multifunctional designs, integrated circuit packaging technology faces the challenge of connecting an increasing number of signal, power, and gr
In advanced electronic packaging, especially in high-density interconnect structures such as BGA (Ball Grid Array) and CSP (Chip Scale Package), solder balls, though tiny, bear multiple responsibilities: electrical connection, mechanical support, and heat
Hidden within the core of smartphones, laptops, servers, and even high-end graphics cards lies a crucial micro-component—BGA (Ball Grid Array) packaged chip—almost invisible to the naked eye.