As a key component for connecting electronic components to printed circuit boards (PCBs), the design and application of solder balls directly affect the stability of the entire system.
In modern electronic manufacturing processes, solder balls are key components that connect chips to substrates, and their mechanical properties are crucial to ensuring the long-term stability and reliability of electronic components.
The diverse substrate materials of flexible electronic devices pose a challenge to the compatibility of lead-free solder balls.
The slow cooling process experienced by the droplets in the droplet method is of great significance in terms of internal density.
Lead-free solder balls play a vital role in electronic packaging processes, especially in BGA (ball grid array) packaging technology.
As an indispensable connection material in the field of electronic packaging, the surface treatment process of solder balls plays a vital role in improving their antioxidant properties.