In actual electronic manufacturing production lines, the compatibility advantages of solder balls have been fully verified.
When the lead-free solder ball enters the soldering process, the dry solder ball can quickly achieve good fusion with the soldering surface.
In the field of multi-chip integrated packaging, solder balls play a vital role. Their connection flexibility brings many significant advantages to the entire packaging process and the performance of the final product.
During long-term use, electronic equipment will inevitably be subjected to mechanical forces such as vibration and impact.
After soldering is completed, you can use special tools to slightly trim the solder joints before the solder completely cools and solidifies.
With the help of microscopes and other precision testing instruments, technicians can zoom in and observe the details on the surface of the solder ball to check whether there are any impurities remaining.