Unlike traditional lead soldering, solder balls form tiny but structurally complete solder joints after reflow soldering. These solder joints not only perform signal transmission functions but also need to maintain long-term reliability under complex cond
Solder balls—miniature metal spheres typically only 0.1 to 0.8 millimeters in diameter—are key interconnect components in advanced packaging technologies.
Though tiny, the solder ball carries immense weight. In the field of industrial control, where reliability requirements are almost demanding, it silently and steadfastly builds a bridge of trust between chips and systems.
During the preheating phase, the heating rate must be controlled at 1.5-2.0°C/second to prevent the solder ball from cracking due to thermal stress or the solder paste solvent from boiling.
Wettability is a fundamental indicator of soldering quality, and the oxide layer on the surface of lead-free solder balls can significantly hinder the direct contact between molten solder and the substrate metal.
As a key connection component in electronic packaging, the fatigue resistance of the solder ball directly affects the reliability of the device in a vibration environment.