Electrical performance is one of the important indicators of solder balls. After long-term use, its electrical performance will also be affected.
Under high temperature conditions during soldering, active substances such as hydrogen ions in the water may chemically react with the lead-free solder ball and pad materials.
As an important material in electronic packaging, lead-free solder balls are gradually replacing traditional lead-containing solders and becoming a safer and more environmentally friendly soldering solution.
Lead-free solder ball plays a vital role in modern electronic packaging process, especially in improving the precision of soldering process.
The reason why solder balls can become the core material of advanced display packaging is mainly due to its advantages in micron-level precision, excellent conductivity
The reason why solder balls have become the preferred interconnection method for flip chip packaging is mainly due to their advantages in high-density interconnection