Why can solder ball become the core material of advanced display packaging?
Publish Time: 2025-05-30
With the continuous advancement of display technology, especially the rise of new display technologies such as Micro-LED and Mini-LED, the requirements for packaging technology are also increasing. As a key connection material, solder ball plays a vital role in these advanced display packages.1. Micron-level precision and high-density interconnectionIn Micro-LED and Mini-LED display technologies, the pixel pitch is very small, usually in the range of tens of microns or even smaller. This means that the connection between each pixel must have extremely high precision and consistency. Due to the high controllability of its manufacturing process, solder ball can achieve micron-level size control, ensuring stable and reliable electrical connection at such a fine scale.2. Excellent conductive performanceSolder ball is usually made of alloys with good conductivity such as tin, silver, and copper, which can provide low-resistance, high-current carrying capacity connections in a very small space. This is particularly important for display devices that need to transmit large amounts of data and power, especially in high-resolution and high-refresh rate application scenarios.3. Thermal expansion coefficient matchingIn advanced display packaging, there is often a large difference in thermal expansion coefficient between the chip and the substrate. Solder balls can effectively alleviate the stress problem caused by this thermal mismatch by selecting the right material combination. For example, using solder balls containing silver or copper components can reduce the difference in thermal expansion coefficient to a certain extent, thereby reducing the risk of interface cracks and failures caused by temperature changes.4. Good mechanical strength and reliabilityThe solder ball not only needs to have excellent electrical conductivity, but also needs to have sufficient mechanical strength to withstand various external forces. In actual applications, display panels may experience a variety of complex working conditions such as bending and vibration. With its solid metal structure, the solder ball can provide a stable physical connection between the chip and the substrate to ensure long-term reliability.5. Adapt to a variety of packaging formsWhether it is traditional surface mount technology (SMT) or more complex three-dimensional stacking packaging (3D Packaging), the solder ball can flexibly cope with it. Especially in advanced packaging forms such as Fan-out Wafer Level Packaging (FOWLP) and Chip-on-Glass (COG), solder balls can achieve efficient and compact interconnection solutions to meet the needs of different application scenarios.6. Support automated production and large-scale manufacturingThe production scale of modern display panels is huge, requiring packaging materials to have high automation compatibility and consistency. Solder balls can be mass-produced through precise printing, reflow soldering and other processes, and maintain stable quality during large-scale manufacturing. This not only improves production efficiency but also reduces costs.7. Environmental protection and sustainable developmentWith the increasing global attention to environmental protection, the research and development and application of lead-free solder balls have become a trend. While meeting environmental regulations such as RoHS and REACH, the new lead-free solder balls still maintain excellent welding performance and reliability, promoting the development of green manufacturing.8. Adapt to extreme environmental conditionsSome high-end display devices may need to work in extreme environments, such as outdoor billboards, aerospace displays, etc. Solder balls can maintain stable performance in a wide temperature range (from low to high temperature), high humidity and corrosive environments, ensuring that display devices can operate normally under harsh conditions.9. Improve display effectThe use of solder balls not only improves the reliability and durability of display devices, but also improves the display effect to a certain extent. For example, in Micro-LED displays, solder balls serve as a connecting bridge between pixels, which helps reduce signal transmission loss and improve display brightness and color uniformity.The reason why solder balls can become the core material of advanced display packaging is mainly due to its advantages in micron-level precision, excellent conductivity, good mechanical strength, adaptability to various packaging forms, and support for large-scale automated production.
